Integrally formed light emitting diode light wire and uses thereof

ABSTRACT

Integrally formed LED light wires are provided, comprising a conductive base comprising a support substrate, wherein the support substrate comprises a first plurality of wires, threads, or a combination thereof, wherein the plurality of wires, threads, or a combination thereof comprises at least one weft element arranged in a first direction and at least two warp elements, each arranged in a second direction such that the at least one weft element and each of the at least two warp elements form plural intersections therebetween, a first bus element and a second bus element, each adapted to distribute power from a power source, a third bus element adapted to distribute a control signal, wherein the first, second, and third bus elements are woven, stitched, or knitted into the support substrate; and a plurality of light emitting diode (LED) modules, each LED module comprising a microcontroller and at least one LED.

CROSS-REFERENCE TO RELATED APPLICATIONS

This utility application is a continuation-in-part of U.S. Ser. No.12/703,116, filed Feb. 9, 2010, which is a continuation-in-part of U.S.Ser. No. 12/355,655, filed Jan. 16, 2009, now U.S. Pat. No. 8,052,303,issued Nov. 8, 2011, which is a continuation-in-part of U.S. Ser. No.11/854,145, filed Sep. 12, 2007, now U.S. Pat. No. 7,988,332, issuedAug. 2, 2011, which claims priority to U.S. Provisional PatentApplication Ser. No. 60/844,184, filed Sep. 12, 2006, the entirety ofwhich is incorporated herein by reference.

Throughout this application, several publications are referenced.Disclosure of these references in their entirety is hereby incorporatedby reference into this application.

The present invention relates to light wires and, more specifically, anintegrally formed light wire containing light emitting diodes (“LEDs”),and the uses of such LED light wire, wherein the LEDs and associatedcircuitry of the LED light wire are protected from mechanical damage andenvironmental hazards, such as water and dust.

BACKGROUND THE INVENTION

Conventional incandescent or LED light wires are commonly used in avariety of indoor and outdoor decorative or ornamental lightingapplications. For example, such conventional light wires are used tocreate festive holiday signs, outline architectural structures such asbuildings or harbors, and provide under-car lighting systems. Theselight wires are also used as emergency lighting aids to increasevisibility and communication at night or when conditions, such as poweroutages, water immersion and smoke caused by fires and chemical fog,render normal ambient lighting insufficient for visibility.

Conventional LED light wires consume less power, exhibit a longerlifespan, are relatively inexpensive to manufacture, and are easier toinstall when compared to light tubes using incandescent light bulbs.Increasingly, LED light wires are used as viable replacements for neonlight tubing.

As illustrated in FIG. 1, conventional light wire 100 consists of aplurality of illuminant devices 102, such as incandescent light bulbs orLEDs, connected together by a flexible wire 101 and encapsulated in aprotective tube 103. A power source 105 creates an electrical currentthat flows through the flexible wire 101 causing the illuminant devices102 to illuminate and create an effect of an illuminated wire. Theilluminant devices 102 are connected in series, parallel, or incombination thereof. Also, the illuminant devices 102 are connected withcontrol electronics in such a way that individual illuminant devices 102may be selectively switched on or off to create a combination of lightpatterns, such as strobe, flash, chase, or pulse.

In conventional light wires, the protective tube 103 is traditionally ahollow, transparent or semi-transparent tube which houses the internalcircuitry (e.g., illuminant devices 102; flexible wire 101). Since thereis an air gap between the protective tube 103 and internal circuitry,the protective tube 103 provides little protection for the light wireagainst mechanical damage due to excessive loads, such as the weight ofmachinery that is directly applied to the light wire. Furthermore, theprotective tube 103 does not sufficiently protect the internal circuitryfrom environmental hazards, such as water and dust. As a result, theseconventional light wires 100 with protective tube 103 are foundunsuitable for outdoor use, especially when the light wires are exposedto extreme weather and/or mechanical abuse.

In conventional light wires, wires, such as flexible wire 101, are usedto connect the illuminant devices 102 together. In terms ofmanufacturing, these light wires are traditionally pre-assembled usingsoldering or crimp methods and then encapsulated via a conventionalsheet or hard lamination process in protective tube 103. Suchmanufacturing processes are labor intensive and unreliable. Furthermore,such processes decrease the flexibility of the light wire.

In response to the above-mentioned limitations associated withconventional light wires and the manufacture thereof, LED light stripshave been developed with increased complexity and protection. These LEDlight strips consist of circuitry including a plurality of LEDs mountedon a support substrate containing a printed circuit and connected to twoseparate electrical conductors or bus elements. The LED circuitry andthe electrical conductors are encapsulated in a protective encapsulantwithout internal voids (which includes gas bubbles) or impurities, andare connected to a power source. These LED light strips are manufacturedby an automated system that includes a complex LED circuit assemblyprocess and a soft lamination process. Examples of these LED lightstrips and the manufacture thereof are discussed in U.S. Pat. Nos.5,848,837, 5,927,845 and 6,673,292, all entitled “Integrally FormedLinear Light Strip With Light Emitting Diode”; U.S. Pat. No. 6,113,248,entitled “Automated System For Manufacturing An LED Light Strip HavingAn Integrally Formed Connected”; and U.S. Pat. No. 6,673,277, entitled“Method of Manufacturing a Light Guide”.

Further, present methods of manufacturing convention light wires alsorequire additional materials and material costs, such as the use ofexpensive bonding film.

Although these LED light strips are better protected from mechanicaldamage and environmental hazards, these LED light strips only provideone-way light direction, and are limited to two separate bus elements inits internal LED circuitry. Also, the manufacturing of such LED lightstrips remains expensive and time-consuming since these LED light stripsat least require a protective encapsulant free of internal voids andimpurities, as well as crimping each LED connector pin to the internalLED circuitry. Further, the lamination process makes these LED lightstrips too rigid to bend.

BRIEF SUMMARY OF THE INVENTION

In light of the above, there exists a need to further improve the art.Specifically, there is a need for an improved integrally formed LEDlight wire that is flexible while having increased mechanical strength,has improved electrical isolation, and provides a smooth, uniformlighting effect from all directions of the integrally formed LED lightwire. There is also a need for an LED light wire with additionallighting functions which is manufactured by a low cost, time-efficientautomated process which has less material cost. Furthermore, there is aneed for a LED light wire which intelligently recognizes, responds andadapts to changes associated with installation, maintenance and failuredetection.

In consideration of the above problems, in accordance with one aspect ofthe present invention, an integrally formed LED light wire, comprising(A) a conductive base comprising a support substrate, wherein thesupport substrate comprises a first plurality of wires, threads, or acombination thereof, wherein the plurality of wires, threads, or acombination thereof comprises at least one weft element arranged in afirst direction and at least two warp elements, each arranged in asecond direction such that the at least one weft element and each of theat least two warp elements form plural intersections therebetween, afirst bus element formed from a second plurality of wires, threads, or acombination thereof adapted to distribute power from a power source, asecond bus element formed from a third plurality of wires, threads, or acombination thereof adapted to distribute power from the power source, athird bus element formed from a fourth plurality of wires, threads, or acombination thereof adapted to distribute a control signal, wherein thefirst, second, and third bus elements are woven, stitched, or knittedinto the support substrate; and (B) a plurality of light emitting diode(LED) modules, each of said plurality of LED modules comprising amicrocontroller and at least one LED, each LED module having first,second, and third electrical contacts electrically coupled to the first,second, and third bus elements, respectively, to draw power from thefirst and second bus elements and to receive a control signal from thethird bus elements.

In another aspect, the integrally formed LED light wire furthercomprises an encapsulant completely encapsulating the conductive baseand the plurality of LED modules, including the respectivemicrocontrollers.

In another aspect, the encapsulant further comprises light scatteringparticles.

In another aspect, the integrally formed LED light wire furthercomprises at least one support warp which comprises a fifth plurality ofwires, threads, or a combination thereof arranged in the seconddirection.

In another aspect, the integrally formed LED light wire wherein aconnection between each of the plurality of LED modules and at least oneof the bus elements is selected from the group consisting of stitching,weaving, knitting, crimping, soldering, welding, or a combinationthereof.

In another aspect, the second, third and fourth plurality of wires,threads, or a combination thereof are each made of a plurality ofconductive wires and/or threads.

In another aspect, the fifth plurality of wires, threads, or acombination thereof is made of a plurality of non-conductive wiresand/or threads.

In another aspect, the conductive wires and/or threads is selected fromthe group consisting of nickel wire, steel wire, iron wire, titaniumwire, copper wire, brass wire, aluminum wire, tin wire, sliver wire,nickel thread, steel thread, iron thread, titanium thread, copperthread, brass thread, aluminum thread, tin thread, sliver thread, or thelike, or a combination thereof.

In another aspect, the non-conductive wires and/or threads is selectedfrom the group consisting of kevlar wire, nylon wire, cotton wire, rayonwire, polyester wire, laminate thread, flat thread, silk thread, glassfiber, polytetrafluoroethylene (“PTFE”), kevlar thread, nylon thread,cotton thread, rayon thread, polyester thread, a solid polymericmaterial, or the like, or a combination thereof.

In another aspect, each of the plurality of LED modules furthercomprises a plurality of LEDs, wherein the plurality of LEDs areselected from the group consisting of red, blue, green, and white LEDs.

In another aspect, each of the plurality of LED modules furthercomprises a fourth contact for outputting the received control signal.

In another aspect, each LED module has a unique address used to controlthe LED module. The unique address is static or dynamic.

In a second aspect of the present invention, an integrally formed LEDlight wire, comprising (A) a conductive base comprising a supportsubstrate, wherein the support substrate comprises a first plurality ofwires, threads, or a combination thereof, wherein the plurality ofwires, threads, or a combination thereof comprises at least one weftelement arranged in a first direction and at least two warp elements,each arranged in a second direction such that the at least one weftelement and each of the at least two warp elements form pluralintersections therebetween, a first, second, third, and fourthconductive bus elements, each formed from a second, third, fourth, andfifth plurality of wires, threads, or a combination thereof,respectively, wherein the first, second, third, and fourth conductivebus elements are woven, stitched, or knitted into the support substrate;and at least one conductor segment arranged between the first and secondconductive bus elements, the at least one conductor segment comprisingat least one LED and a sixth plurality of wires, threads, or acombination thereof, wherein the at least one conductor segment iswoven, stitched, or knitted into the support substrate; and (b) at leastone sensor electrically coupled to the third and fourth conductive buselements, the third conductive bus element is adapted to transmitsignals from the at least one sensor, and the fourth conductive bus isadapted to provide power to the at least one sensor.

In another aspect, the second conductive bus element is a ground and theat least one sensor is additionally electrically coupled to the secondconductive bus element.

In another aspect, the integrally formed LED light wire furthercomprises an encapsulant completely encapsulating the conductive base,and the at least one sensor electrically coupled to the third and fourthconductive bus elements.

In another aspect, the encapsulant further comprises light scatteringparticles.

In another aspect, the integrally formed LED light wire wherein aconnection between the at least one LED and the sixth plurality of wiresis selected from the group consisting of stitching, weaving, knitting,crimping, soldering, welding, or a combination thereof.

In another aspect, the outer profile of the encapsulant comprising analignment key and an alignment keyhole located at opposite sides of theintegrally formed LED light wire.

In another aspect, a lighting panel comprising a plurality of theintegrally formed LED light wires set forth herein.

BRIEF DESCRIPTION OF THE FIGURES

For the purposes of illustrating the present invention, the drawingsreflect a form which is presently preferred; it being understoodhowever, that the invention is not limited to the precise form shown bythe drawings in which:

FIG. 1 is a representation of a conventional light wire;

FIG. 2 is a top view illustrating an integrally formed LED light wireaccording to an embodiment of the present invention;

FIG. 3 is a cross-sectional view of the integrally formed LED light wireshown in FIG. 2;

FIG. 4A is a side view of an integrally formed LED light wire accordingto another embodiment of the present invention;

FIG. 4B is a top view of the integrally formed LED light wire shown inFIG. 4B;

FIG. 5A is a cross-sectional view of the integrally formed LED lightwire shown in FIGS. 4A & 4B;

FIG. 5B is a cross-sectional view of an integrally formed LED light wireaccording to another embodiment of the present invention;

FIG. 6A is an embodiment of a conductive base;

FIG. 6B is a schematic diagram of the conductive base of FIG. 6A;

FIG. 7A is another embodiment of a conductive base;

FIG. 7B is a schematic diagram of the conductive base of FIG. 7A;

FIG. 8A is another embodiment of a conductive base;

FIG. 8B is a schematic diagram of the conductive base of FIG. 8A;

FIG. 9A is another embodiment of a conductive base;

FIG. 9B is a schematic diagram of the conductive base of FIG. 9A;

FIG. 10A is another embodiment of a conductive base;

FIG. 10B is a schematic diagram of the conductive base of FIG. 10A;

FIG. 11A is another embodiment of a conductive base;

FIG. 11B is a schematic diagram of the conductive base of FIG. 11A,

FIG. 11C depicts an embodiment of a conductive base wrapped on a coreprior to encapsulation;

FIG. 12A depicts an embodiment of an LED mounting area of a conductivebase;

FIG. 12B depicts an LED mounted on the LED mounting area shown in FIG.12A;

FIG. 13 depicts LED chip bonding in another embodiment of an LEDmounting area;

FIG. 14A depicts the optical properties of an integrally formed LEDlight wire according to an embodiment of the present invention;

FIG. 14B depicts a cross-sectional view of a dome-shaped encapsulant andthe optical properties thereof;

FIG. 14C depicts a cross-sectional view of a flat-top-shaped encapsulantand the optical properties thereof;

FIGS. 15A-C depict a cross-sectional view of three different surfacetextures of the encapsulant;

FIG. 16A is a schematic diagram of an integrally formed LED light wireaccording to an embodiment of the present invention;

FIG. 16B depicts an embodiment of the integrally formed LED light wireshown in FIG. 16A;

FIG. 16C is a block diagram illustrating the integrally formed LED lightwire shown in FIG. 16B;

FIG. 17A is a block diagram of an integrally formed LED light wireaccording to another embodiment of the present invention;

FIG. 17B is a cross-sectional view of the integrally formed LED lightwire shown in FIG. 17A;

FIG. 17C is a block diagram illustrating an integrally formed LED lightwire according to an embodiment of the present invention;

FIG. 18 is a block diagram illustrating an integrally formed LED lightwire containing at least a sensor or detector according to an embodimentof the present invention;

FIG. 19A is a schematic diagram of a full color integrally formed LEDlight wire according to an embodiment of the present invention;

FIG. 19B is a block diagram illustrating an embodiment of the integrallyformed LED light wire shown in FIG. 19A;

FIG. 20 is a schematic diagram of a control circuit for a full colorintegrally formed LED light wire;

FIG. 21 is a timing diagram for a full color integrally formed LED lightwire;

FIG. 22A is a timing diagram for a full color integrally formed LEDlight wire;

FIG. 22B is a timing diagram for a full color integrally formed LEDlight wire;

FIG. 23 is a schematic diagram of an integrally formed LED light wirecontaining a plurality of LED modules according to an embodiment of thepresent invention;

FIG. 24 is a layout diagram of the integrally formed LED light wireshown in FIG. 23;

FIG. 25A is a block diagram illustrating a lighting panel comprising aplurality of integrally formed LED light wires with interlockingalignment system according to an embodiment of the present invention;

FIG. 25B is a cross-sectional view of the lighting panel shown in FIG.25A;

FIG. 25C is a cross-sectional view of a lighting panel comprising aplurality of integrally formed LED light wires according to anotherembodiment of the present invention

FIG. 26 is a diagram showing an LED module suitable for use in dynamicaddressing in the integrally formed LED light wire described in thepresent application;

FIG. 27 is a diagram showing plural LED modules as shown in FIG. 26connected in a light wire configuration;

FIGS. 28A and 28B are a schematic diagram and a depiction of anexemplary weave pattern, respectively;

FIGS. 28C and 28D are a schematic diagram and a depiction of anexemplary knitting stitching pattern, respectively;

FIGS. 29A and 29B is a cross-sectional view and a top perspective view,respectively, of a conductive base of an integrally formed LED lightwire according to another embodiment of the present invention;

FIG. 30 is a top perspective view of the integrally formed LED lightwire of FIGS. 29A and 29B with a PCB electrically connected viastitching to the conductive base; and

FIGS. 31A and 31B is a bottom perspective view and a top perspectiveview, respectively, of the integrally formed LED light wire of FIGS. 29Aand 29B with an LED electrically connected via crimping to theconductive base.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an integrally formed LED light wirecontaining a plurality of LEDs that are connected in series, parallel ora combination thereof on at least one conductive bus element which formsa mounting base or on at least two conductive bus elements mounted on asupport substrate made of insulating material (e.g., plastic) to providea mounting base. The mounting base provides electrical connection and aphysical mounting platform or a mechanical support for the LEDs. Themounting base can also act as or include a light reflector for the LEDs.The mounting base and LEDs are encapsulated in a transparent orsemi-transparent encapsulant which may contain light scatteringparticles.

In one embodiment of the present invention, as shown in FIGS. 2 and 3,an integral LED light wire, which includes a sub-assembly 310 comprisingat least one LED 202 connected to a conductive base 201, thesub-assembly 310 is encapsulated within an encapsulant 303, and theconductive base 201 comprises one conductive bus element formed from aconductive material capable of distributing power from a power source.As shown in FIG. 2, the LEDs 202 are connected in series. Thisembodiment offers the advantage of compactness in size, and allows theproduction of a long, thin LED light wire with an outer diameter of 3 mmor less. The conductive base 201 is operatively connected to a powersource 205 to conduct electricity.

In another embodiment, as illustrated in FIGS. 4A, 4B, and 5A, thepresent invention may be an integrally formed LED light wire 400comprising a plurality of sub-assemblies 510. Each sub-assembly 510comprises at least one LED 202 connected to a conductive base 401,wherein the conductive base 401 has two conductive bus elements 401A and401B. The sub-assemblies 510 are encapsulated within an encapsulant 503.As shown, the LEDs 202 are connected in parallel. The conductive base401 is operatively connected to a power source 405 to activate LEDs 202.

In another embodiment, as shown in FIG. 5B, the present invention mayinclude a plurality of sub-assemblies 750. Each sub-assembly 750includes at least one LED 202 (for example, a SMD-On-Board LED)connected to a conductive base 94 having at least two conductive buselements 94A and 94B, wherein the conductive base 94 is mounted on asupport substrate 90.

AC or DC power from a power source, such as power source 405, may beused to power the integrally formed LED light wire. Additionally, acurrent source may be used. Brightness may be controlled by digital oranalog controllers.

The conductive base 94, 201, 401 extends longitudinally along the lengthof the integrally formed LED light wire, and act as an electricalconductor, and as a physical mounting platform or a mechanical supportfor the LEDs 202. The conductive base can also act as or include a lightreflector for the LEDs 202.

The conductive base 201, 401 may be, for example, punched, stamped,printed, silk-screen printed, or laser cut, or the like, from a metalplate or foil to provide the basis of an electrical circuit, and may bein the form of a thin film or flat strip. The conductive bus elements ofconductive base 94, 201, 401, and conductive segments (discussed below)may also be formed using rigid electrical conductive materials (such asmetal rod, metal strip, copper plate, copper clad steel plate, metalstrip, a rigid base material coated with an electrically conductivematerial, or the like), or flexible electrical conductive materials(such as thin metal strip, copper clad alloy wire, stranded wire,braided wire, or the like). Stranded wire or braided wire may be flat orround, and comprises a plurality of electrical conductive fine wiresmade of copper, brass, aluminum, or the like; such fine wires may bebare or coated with electrical conductive materials including, but notlimited to, tin, nickel, silver, or the like. Metal, mentioned in thisparagraph, may include copper, brass, aluminum, or the like.

In a preferred embodiment, flat braided wire is used as conductive buselements or conductive segments, said conductive bus elements orconductive segments are flexible. The use of flat braided wire in thepresent invention promotes increased flexibility in a directionperpendicular to the length of the flat conductive bus elements. Also,flat braided wire provides higher thermal conductivity to dissipate moreefficiently the heat from the LEDs, thereby allowing the presentinvention to operate at higher power and achieve greater brightness thanconventional light wires with solid flat strips.

Also, generally speaking, the maximum length of the LED light wires isdetermined by the conductivity of the conductive bus elements. Inconventional LED light wires, the voltage drop in the power busincreases as the LED light wires becomes longer due to its resistanceand increasing current flow drawn by the increasing load of additionalLEDs. Eventually, the voltage drop becomes too great at a particularmaximum length of the LED light wire. In an aspect of the presentinvention, the maximum length of the integrally formed LED light wirecan be increased by increasing the cross-sectional area of theconductive bus (e.g., increasing the gauge of braided wire used asconductive bus elements or segments), thereby reducing its resistanceper unit length.

The conductive bus elements of conductive base 94 may be mounted on asupport substrate 90 via adhesion, lamination, extrusion, or casting.The support substrate 90 may be made of rigid or flexible plastic, suchas polyethylene terephthalate (PET), polyvinyl chloride (PVC), andthermoplastic polyurethane (TPU).

Additional circuitry, such as active or passive control circuitcomponents (e.g., a microprocessor, a resistor, a capacitor), may beadded and encapsulated within an encapsulant to add functionality to theintegrally formed LED light wire. Such functionality may include, butnot limited to, current limiting (e.g., resistor 10), protection,flashing capability, or brightness control. For example, amicrocontroller or microprocessor may be included to make the LEDs 202individually addressable; thereby, enabling the end user to control theillumination of selective LEDs 202 in the LED light wire to form avariety of light patterns, e.g., strobe, flash, chase, or pulse. In oneembodiment, external control circuitry is connected to the conductivebase 94, 201, 401.

First Embodiment of the Conductive Base

In a first embodiment of the conductive base assembly 600, shown in FIG.6A, the base material of the conductive base 601 is preferably a longthin narrow metal strip or foil. In one embodiment, the base material iscopper. A hole pattern 602, shown as the shaded region of FIG. 6A,depict areas where material from the conductive base 601 has beenremoved. In one embodiment, the material has been removed by a punchingmachine. The remaining material of the conductive base 601 forms thecircuit of the present invention. Alternatively, the circuit may beprinted on the conductive base 601 and then an etching process is usedto remove the areas 602. The pilot holes 605 on the conductive base 600act as a guide for manufacture and assembly.

The LEDs 202 are mounted either by surface mounting or LED chip bondingand soldered, welded, riveted or otherwise electrically connected to theconductive base 601 as shown in FIG. 6A. The mounting and soldering ofthe LEDs 202 onto the conductive base 601 not only puts the LEDs 202into the circuit, but also uses the LEDs 202 to mechanically hold thedifferent unpunched parts of the conductive base 601 together. In thisembodiment of the conductive base 601 all of the LEDs 202 areshort-circuited, as shown in FIG. 6B. Thus, additional portions ofconductive base 601 are removed as discussed below so that the LEDs 202are not short-circuited. In one embodiment, the material from theconductive base 601 is removed after the LEDs 202 are mounted.

Second Embodiment of the Conductive Base

To create series and/or parallel circuitries, additional material isremoved from the conductive base. For example, additional portions ofthe conductive base are removed between the terminals of the LEDs 202after the LEDs 202 are mounted on the conductive base; thereby, creatingat least two conductors wherein each conductor is electrically separate,but then coupled to each other via the LEDs 202. As shown in FIG. 7A,the conductive base 701 has an alternative hole pattern 702 relative tothe hole pattern 602 depicted in FIG. 6A. With the alternative holepattern 702, the LEDs 202 (such as the three shown in FIGS. 7A and 7B)are connected in series on the conductive base 701. The seriesconnection is shown in FIG. 7B, which is a schematic diagram of theconductive base assembly 700 shown in FIG. 7A. As shown, the mountingportions of LEDs 202 provide support for the conductive base 701.

Third Embodiment of the Conductive Base

In a third embodiment of the conductive base, as shown in FIG. 8A, aconductive base assembly 800 is depicted having a pattern 802 that ispunched out or etched into the conductive base 801. Pattern 802 reducesthe number of punched-out gaps required and increase the spacing betweensuch gaps. Pilot holes 805 act as a guide for the manufacturing andassembly process. As shown in FIG. 8B, the LEDs 202 are short-circuitedwithout the removal of additional material. In one embodiment, thematerial from conductive base 801 is removed after the LEDs 202 aremounted.

Fourth Embodiment of the Conductive Base

As illustrated in FIG. 9A, a fourth embodiment of the conductive baseassembly 900 contains an alternative hole pattern 902 that, in oneembodiment, is absent of any pilot holes. Compared to the thirdembodiment, more gaps are punched out in order to create two conductingportions in the conductive base 901. Thus, as shown in FIG. 9B, thisembodiment has a working circuit where the LEDs 202 connected in series.

Fifth and Sixth Embodiments of the Conductive Base

FIG. 10A illustrates a fifth embodiment of conductive base assembly 1000of the conductive base 1001. Shown is a thin LED light wire with atypical outer diameter of 3 mm or less. As shown in FIG. 10A, (1) theLEDs 202 connected on the conductive base 1001 are placed apart,preferably at a predetermined distance. In a typical application, theLEDs 202 are spaced from 3 cm to 1 m, depending upon, among otherthings, at least the power of the LEDs used and whether such LEDs aretop or side-emitting. The conductive base 1001 is shown absent of anypilot holes. The punched-out gaps that create a first hole pattern 1014that are straightened into long thin rectangular shapes. The gaps 1030under the LEDs 202 are punched out after the LEDs 202 are mounted toconductive base 1001, or, in the alternative, LEDs 202 are mounted overpunched-out gaps 1030. However, as shown in FIG. 10B, the resultantcircuit for this embodiment is not useful since all the LEDs 202 areshort-circuited. In subsequent procedures, additional material isremoved from conductive base 1001 so that LEDs 202 are in series orparallel as desired.

In the sixth embodiment of the conductive base assembly 1100, conductivebase 1101, as shown in FIG. 11A, contains a hole pattern 1118 whichcreates a working circuit in the conductive base 1101 with a seriesconnections of LEDs 202 mounted onto the conductive base 1101. Thisembodiment is useful in creating a thin LED light wire with a typicaloutside diameter of 3 mm or less.

Additional Embodiments of the Conductive Base

FIGS. 29A and 29B illustrate another embodiment of conductive base 4000which is weaved and/or knitted with a plurality of wires and/or threads.As shown, the conductive base 4000 includes a support substrate 4100containing a plurality of wires and/or threads, wherein the plurality ofwires comprises at least one wire or thread as a weft element (e.g.,weft element 4510) and at least two wires and/or threads as warpelements (e.g., warp elements 4511 and 4512). The conductive base 4000can include at least one support warp (e.g., support warps 4513 and4514) which comprises a plurality of warp elements grouped together andare in approximately parallel to one another. The support warps 4513 and4514 provide additional mechanical strength while encouraging enhancedflexibility of the conductive base 4000.

Regarding the support substrate, the at least one weft element 4510 canbe arranged in a first direction and the at least two warp elements 4511and 4512 can be arranged in a second direction such that the weftelement 4510 and each of the warp elements 4511 and 4512 form pluralintersections therebetween. The weft element 4510 and each of the warpelements 4511 and 4512 can be arranged approximately perpendicular or atother angles (but not parallel) to each other at such pluralintersections. The support substrate can be conductive or notconductive, and can be made with conductive and/or non-conductive wiresand/or threads. Conductive wire or thread includes, but is not limitedto, flexible electrical conductive material (such as copper clad allowwire, stranded wire, braided wire, or the like). Stranded wire orbraided wire may be flat or round, and comprises a plurality ofelectrical conductive fine wires made of nickel, steel, iron, titanium,copper, brass, aluminum, or the like, or non-metal conductive such ascarbon fiber, or a combination thereof; such fine wires may be bare orcoated with electrical conductive materials including, but not limitedto, tin, nickel, silver, or the like. A fine wire or thread made of tin,nickel, steel, titanium, silver, copper, brass, aluminum, or the likecan also be used in the support substrate. Non-conductive wire or threadincludes, but is not limited to, kevlar, nylon, cotton, rayon,polyester, laminate thread, flat thread, silk thread, glass fiber,polytetrafluoroethylene (“PTFE”), any solid polymeric material, or thelike, or a combination thereof.

In addition to a support substrate, the conductive base 4000 includesconductive bus elements 4061, 4062, and 4063, wherein the conductive buselements each comprises a plurality of wires, wherein the plurality ofwires comprises at least one wire or thread that is weaved and/orknitted into the support substrate. The conductive bus elements can beadapted in the following manner: a first conductive bus element 4061 canbe adapted to distributed power from a power source; a second conductivebus element 4062 can be adapted to distributed a control signal; and athird conductive bus element 4063 can be adapted as a ground. However,the adaptations listed above can be changed between the conductive buselements. The conductive base 4000 also include more than threeconductive bus elements.

Electronic components, such as LEDs, resistors, diodes, transistors,fuses, or any integrated circuits can be directly mounted on theconductive base 4000, or can be pre-assembled on a printed circuit board(e.g., rigid PCB or flexible PCB) and then the printed circuit board canbe mounted on the conductive base 4000. Mounting methods includes, butnot limited to, soldering, welding, crimping, stitching, weaving,knitting, or a combination thereof.

Conductive base 4000 can be constructed by hand, a weaving machineand/or a knitting machine. Since the components of this embodiment aremainly made of a plurality of wires and/or thread, manufacturing of thisembodiment requires a decreased number of different components, which inturn present decreased material costs and increasedenvironmental-friendly manufacturing processes. In addition, theflexibility of the embodiment provides versatility in creating organicform factors, and it can take on the personality of paper and/or fabric.For example, the embodiment can be used to create LED lighting wallpaperor LED clothing.

As shown in FIGS. 30, 31A & 31B, LED 202 can be mounted onto theconductive base 4000 by soldering, welding, crimping, stitching,weaving, knitting, or a combination thereof. For example, LED 202 can beelectrically connected to at least one of the conductive bus elements4061, 4062, 4063 by stitching, weaving, and/or knitting with at least aconductive wire or thread, or by crimping. The LED 202 can also besoldered onto at least one of the bus elements 4061, 4062, 4063 of theconductive base 4000.

This embodiment of the conductive base 4000 can be used in allembodiments of the integrally formed LED light wire disclosed in thisapplication.

LEDs

The LEDs 202 may be, but are not limited to, individually-packaged LEDs,chip-on-board (“COB”) LEDs, leaded LEDs, surface mount LEDs,SMD-On-Board LEDs, or LED dies individually die-bonded to the conductivebase 301. The PCB for COB LEDs and SMD-On-Board LEDs may be, forexample, FR4 PCB, flexible PCB, or metal-core PCB. The LEDs 202 may alsobe top-emitting LEDs, side-emitting LEDs, or a combination thereof.

The LEDs 202 are not limited to single colored LEDs. Multiple-coloredLEDs may also be used. For example, if Red/Blue/Green LEDs (RGB LEDs)are used to create a pixel, combined with a variable luminance control,the colors at each pixel can combine to form a range of colors.

Mounting of LEDs onto the Conductive Base

As indicated above, LEDs 202 are mounted onto the conductive base bymethods known in the art, including surface mounting, LED chip bonding,spot welding and laser welding.

In surface mounting, as shown in FIGS. 12A and 12B, the conductive base1201 is first punched to assume any one of the embodiments discussedabove, and then stamped to create an LED mounting area 1210. The LEDmounting area 1210 shown is exemplary, and other variations of the LEDmounting area 1210 are possible. For example, the LED mounting area 1210may be stamped into any shape which can hold an LED 202, or not stamped.

A soldering material 1210 (e.g., liquid solder; solder cream; solderpaste; and any other soldering material known in the art) or conductiveepoxy is placed either manually or by a programmable assembly system inthe LED mounting area 1220, as illustrated in FIG. 12A. LEDs 202 arethen placed either manually or by a programmable pick and place stationon top of the soldering material 1210 or a suitable conductive epoxy.The conductive base 1201 with a plurality of LEDs 202 individuallymounted on top of the soldering material 1210 may directly go into aprogrammable reflow chamber where the soldering material 1210 is meltedor a curing oven where the conductive epoxy is cured. As a result, theLEDs 202 are bonded to the conductive base 1201 as shown in FIG. 12B.

As illustrated in FIG. 13, LEDs 202 may be mounted onto the conductivebase 1301 by LED chip bonding. The conductive base 1301 is stamped tocreate a LED mounting area 1330. The LED mounting area 1330 shown inFIG. 13 is exemplary, and other variations of the LED mounting area1330, including stamped shapes, like the one shown in FIG. 12A, whichcan hold an LED, are envisioned. LEDs 202, preferably an LED chip, areplaced either manually or by a programmable LED pick place machine ontothe LED mounting area 1330. The LEDs 202 are then wire bonded onto theconductive base 1301 using a wire 1340. It should be noted that wirebonding includes ball bonding, wedge bonding, and the like.Alternatively, LEDs 202 may be mounted onto the conductive base 301using a conductive glue or a clamp.

As stated above, as shown in FIGS. 30, 31A & 31B, LED 202 can be mountedonto the conductive base 4000 by stitching, weaving, knitting orcrimping. For example, LED 202 can be electrically connected to at leastone of the conductive bus elements 4061, 4062, 4063 by stitching,weaving, and/or knitting with at least a conductive wire or thread, orby crimping. The LED 202 can also be soldered or welded onto at leastone of the conductive bus elements 4061, 4062, 4063 of the conductivebase 4000. By way of example, as shown in FIG. 30, the PCB 1200 (whichwould have a LED 202 electrically connected thereto) has at least oneeyelet 1320 where at least a conductive wire or thread can be threadedthrough the at least one eyelet 1320 and stitched, weaved, and/orknitted into at least one of conductive bus elements of the conductivebase 4000 to create an electrical connection between the LED 202 and theconductive base 4000. In another example as depicted in FIGS. 31A-31B,the LED 202 is electrically connected to PCB 1200 which has a crimpingarm 1211, the crimping arm 1211 is electrically connected to firstconductive bus 4061.

It should be noted that the conductive base in the above embodiments canbe twisted in an “S” shape. Then, the twisting is reversed in theopposite direction for another predetermined number of rotations;thereby, making the conductive base form a shape of a “Z”. This “S-Z”twisted conductive base is then covered by an encapsulant. With its“S-Z” twisted placement, this embodiment will have increasedflexibility, as well as emit light uniformly over 360°.

In another embodiment, as shown in FIG. 11C, conductive base (e.g.,conductive base 1101) delivering electrical current to the LEDs is woundinto spirals. The spiraling process can be carried out by a conventionalspiraling machine, where the conductive base is placed on a rotatingtable and a core 9000 passes through a hole in the center of the table.The pitch of the LED is determined by the ratio of the rotation speedand linear speed of the spiraled assembly. The core 9000 may be in anythree-dimensional shape, such as a cylinder, a rectangular prism, acube, a cone, a triangular prism, and may be made of, but not limitedto, polymeric materials such as polyvinyl chloride (PVC), polystyrene,ethylene vinyl acetate (EVA), polymethylmethacrylate (PMMA) or the like,or, in one embodiment, elastomer materials such as silicon rubber. Thecore 9000 may also be solid. In one embodiment, the conductive basedelivering electrical current to the LEDs is wound into spirals on asolid plastic core and then encapsulated in a transparent elastomerencapsulant.

Encapsulant

The encapsulant provides protection against environmental elements, suchas water and dust, and damage due to loads placed on the integral LEDlight wire. The encapsulant may be flexible or rigid, and transparent,semi-transparent, opaque, and/or colored. The encapsulant may be madeof, but not limited to, polymeric materials such as polyvinyl chloride(PVC), polystyrene, ethylene vinyl acetate (EVA), polymethylmethacrylate(PMMA) or other similar materials or, in one embodiment, elastomermaterials such as silicon rubber.

Fabrication techniques concerning the encapsulant include, withoutlimitation, extrusion, casting, molding, laminating, injection molding,or a combination thereof.

In addition to its protective properties, the encapsulant can assist inthe scattering and guiding of light in the LED light wire. Asillustrated in FIG. 14, that part of the light from the LEDs 202 whichsatisfies the total internal reflection condition will be reflected onthe surface of the encapsulant 1403 and transmitted longitudinally alongthe encapsulant 1403. Light scattering particles 1404 may be included inthe encapsulant 1403 to redirect such parts of the light as shown bylight path 1406, as well as attenuate or eliminate hot spots of light.The light scattering particles 1404 are of a size chosen for thewavelength of the light emitted from the LEDs. In a typical application,the light scattering particles 1404 have a diameter in the scale ofnanometers and they can be added to the polymer either before or duringthe extrusion process. Further, as shown in FIG. 14A, conductive base1401 can also act as or include a light reflector within the LED lightwire.

The light scattering particles 1404 may also be a chemical by-productassociated with the preparation of the encapsulant 1403. Any materialthat has a particle size (e.g., a diameter in the scale of nanometers)which permits light to scatter in a forward direction can be a lightscattering particle.

The concentration of the light scattering particles 1404 is varied byadding or removing the particles. For example, the light scatteringparticles 1404 may be in the form of a dopant added to the startingmaterial(s) before or during the extrusion process. Also, air bubbles orany other internal voids may be used as a light scattering particle1404. The concentration of the light scattering material 1404 within theencapsulant 1403 is influenced by the distance between LEDs, thebrightness of the LEDs, and the uniformity of the light. A higherconcentration of light scattering material 1404 may increase thedistance between neighboring LEDs 202 within the LED light wire. Thebrightness of the LED light wire may be increased by employing a highconcentration of light scattering material 1404 together within closerspacing of the LEDs 202 and/or using brighter LEDs 202. The smoothnessand uniformity of the light within the LED light wire can be improved byincreasing the concentration of light scattering material 1404 mayincrease such smoothness and uniformity.

As shown in FIGS. 3, 5A and 5B, the sub-assemblies 310, 510 and 750 aresubstantially at the center of the encapsulant. The sub-assemblies 310,510 and 750 are not limited to this location within the encapsulant. Thesub-assemblies 310, 510 and 750 may be located anywhere within theencapsulant. Additionally, the cross-sectional profile of theencapsulant is not restricted to circular or oval shapes, and may be anyshape (e.g., square, rectangular, trapezoidal, star). Also, thecross-sectional profile of the encapsulant may be optimized to provideeither a narrow or wide viewing angle (see light paths 1450 and 1460 inFIGS. 14B (dome-shaped profile of encapsulant 222) and 14C (flat-topprofile of encapsulant 223), respectively) and/or lensing for lightemitted by the LEDs 202. For example, another thin layer of encapsulantmay be added outside the original encapsulant to further control theuniformity of the emitted light from the present invention.

Surface Texturing and Lensing

The surface of the integral LED light wire can be textured and/or lensedfor optical effects. The integral LED light wire may be coated (e.g.,with a fluorescent material), or include additional layers to controlthe optical properties (e.g., the diffusion and consistency ofilluminance) of the LED light wire. Additionally, a mask may be appliedto the outside of the encapsulant to provide different textures orpatterns.

Different design shapes or patterns may also be created at the surfaceof the encapsulant by means of hot embossing, stamping, printing and/orcutting techniques to provide special functions such as lensing,focusing, and/or scattering effects. As shown in FIGS. 15A-C, thepresent invention includes formal or organic shapes or patterns (e.g.,dome, waves, ridges) which influences light rays 1500 to collimate (FIG.15A), focus (FIG. 15B), or scatter/diffuse (FIG. 15C). The surface ofthe encapsulant may be textured or stamped during or following extrusionto create additional lensing. Additionally, the encapsulant 93, 303 and503 may be made with multiple layers of different refractive indexmaterials in order to control the degree of diffusion.

Applications of Integrally Formed LED Light Wire

The present invention of the integrally formed LED light wire finds manylighting applications. The following are some examples such as LED lightwires with 360° Illumination, full color LED light wires, LED lightwires with sensor or detectors, and LED light wires with individuallycontrolled LEDs. Also, the LED light wires may aligned side-by-side orstacked in order to create a lighting panel. It should be noted thatthese are only some of the possible light wire applications.

The three copper wires 161, 162, 163 delivering electrical power to theLEDs 202 shown in FIG. 16B forming the conductive base may be wound intospirals (see FIG. 11C). The LEDs are connected to the conductors bysoldering, ultrasonic welding or resistance welding. Each neighboringLED can be orientated at the same angle or be orientated at differentangles. For example, one LED is facing the front, the next LED is facingthe top, the third LED is facing the back, and the fourth one is facingthe bottom etc. Thus, the integrally formed LED light wire canilluminate the whole surrounding in 360°.

An embodiment of the integrally formed LED light wire is shown in FIGS.16B and 16C. As shown, there are two continuous conductors identified asconductive bus elements 161 and 163. Zero ohm jumpers or resistors 10couple conductor segments 162 to conductive bus elements 161 and 163 toprovide power to LED elements 202. As shown in FIG. 16B, conductive buselements 161 and 163 are mounted on a support substrate 90. In apreferred embodiment, the conductive bus elements 161 and 163 andsupport substrate 90 are flexible. In another embodiment, the LED lightwire with flexible support substrate is wound in spirals about a core9000 (see, for example, FIG. 11C), and then is encapsulated in anencapsulant.

Another embodiment of the integrally formed LED light wire is shown inFIG. 30 with conductive base 4000. As shown, there is a conductive base4000 which includes a support substrate 4100 containing a plurality ofwires and/or threads, wherein the plurality of wires comprises at leastone wire or thread as a weft element (e.g., weft element 4510) and atleast two wires and/or threads as warp elements (e.g., warp elements4511 and 4512). In this exemplary embodiment, there are conductive buselements 4061, 4062, and 4063, wherein each conductive bus element arecan be formed from a plurality of wires and/or threads. The conductivebase 4000 has support warps 4513 and 4514. The conductive base 4000 canhave one or more conductive bus elements and/or one or more supportwarps. PCB 1200 (which has LED 202 electrically connected thereto) hasat least one eyelet 1320 wherein at least a conductive wire or threadcan be threaded through the at least one eyelet 1320 and stitched,weaved, and/or knitted into at least one of the bus elements of theconductive base 4000 to create an electrical connection between the LED202 and the conductive base 4000. Here, PCB 1200 is stitched to secondbus element 4062, and thereby creating an electrical connection betweenthe LED 202 and the conductive base 4000.

Another embodiment of the LED light wire is shown in FIGS. 31A and 31B.In this exemplary embodiment, the LED 202 is electrically connected toPCB 1200, wherein PCB 1200 has a crimping arm 1211, and the crimping arm1211 is electrically connected to conductive bus element 4061.

The integrally formed LED light wire is not limited to single color. Forfull color application, the single color LED is replaced by multipleLEDs or an LED group consisting of four sub-LEDs in four differentcolors: red, blue, green, and white as shown in FIG. 20. The intensityof each LED group (one pixel) can be controlled by adjusting the voltageapplied across each sub-LED. The intensity of each LED is controlled bya circuit such as the one shown in FIG. 20.

In FIGS. 20, L1, L2, and L3 are the three signal wires for supplyingelectric powers to the four LEDs in each pixel. The color intensity ofeach sub-LED is controlled by a μController 6000 with the timing chartgiven in FIG. 21.

As shown in FIG. 21, because the line voltage L2 is higher than the linevoltage L1 over the first segment of time, the red LED (R) is turned on,whereas, during the same time interval, all the other LEDs are reversebiased and hence they are turned off. Similarly, in the second timeinterval, L2 is higher than L3 thus turning on the green LED (G) andturning off all the other LEDs. The turning on/off of other LEDs insubsequent time segments follows the same reasoning.

New colors such as cold white and orange apart from the four basic onescan be obtained by mixing the appropriate basic colors over a fractionof a unit switching time. This can be achieved by programming amicroprocessor built into the circuit. FIG. 22A and FIG. 22B show thetiming diagrams of color rendering for cold white and orangerespectively. It should be noted that the entire color spectrum can berepresented by varying the timing of signals L1, L2, and L3.

In one embodiment of the invention, the integrally formed LED light wireincludes a plurality of pixels (LED modules), wherein each pixel has oneor more LEDs, and each pixel can be controlled independently using amicroprocessor circuit integrated with said one or more LEDs. Each pixelis a LED module comprising a microcontroller and at least one or moreLEDs (e.g., a single R,G,B, or W LED, three (RGB) LEDs, or four (RGBW)LEDs). FIG. 27 illustrates an exemplary plurality of pixels (LED modules2100), each pixel with four (RGBW) LEDs. Each LED module 2100 isassigned a unique address. When this address is triggered, that LEDmodule is lit up. The LED modules are serially connected with a signalwire based on a daisy chain or star bus configuration. Alternatively,the LED modules 2100 are arranged in parallel.

There are two ways to assign an address for each LED module in theintegrally formed LED light wire. The first approach is staticaddressing in which each pixel is pre-assigned a fixed address duringmanufacture, and is unable to monitor any changes, particularly as topixel failure or a changed length of the LED light wire. The secondapproach is dynamic addressing in which each pixel is assigned anaddress dynamically with its own unique address and each pixel beingcharacterized by its own “address” periodically with a trigger signal.Alternatively, the address is assigned dynamically when powered on.Because dynamic addressing allows the LED modules to reconfigure theiraddressing based on the signals received at an LED module, theintegrally LED light wires which use such dynamically addressable LEDmodules can achieve flexibility as to installation, maintenance, failuredetection and repair.

In an embodiment, the integrally formed LED light wire includes pixels(LED modules) in which the addresses of the pixels are assigneddynamically, by the pixels themselves, rather than preset duringmanufacture, as in static addressing. As shown in FIGS. 26 and 27, eachLED module 2000 preferably comprises LEDs 2004 (either R,G, B or W LEDs,or a combination thereof); a microcontroller 2002; a data port (DATA);two I/O ports, one of which is configured to be the output port (S0) andone of which is configured to be the input port (S1); one power port(VCC); and one ground port (GND). The diagrammatic layout and wiring ofan individual LED module 2000 is shown in FIG. 26.

The function of microcontroller 2002 in each LED module 2000 is to (a)receive data from its own data port and to receive commands and graphicsignals, (b) process the dynamic address system, and (c) drive theLED(s) in their own LED module, each LED module forming a pixel.

The LED modules 2000 are preferably connected as follows:

-   -   The VCC and GND ports are each connected to the power and ground        buses, respectively.    -   The DATA ports are connected a common bus. Such common bus can        transmit control signals to and from LED modules. A control        signal can be, for example, a request from a LED module to the        remote display memory 2006 for data (e.g., display data (e.g.,        current display information)), or data from remote display        memory 2006 to a specific LED module regarding current display        information.    -   The I/O ports is an out-port and is grounded and the I/O ports        S1 is an in-port and is connected to VCC. The in- and out-ports        of neighboring LED modules are interconnected as shown in        schematic form in FIG. 27. The in-port (S1) of the last LED        module in the integrally formed LED light wire only has a        connection to its out-port (S0), while its in-port (S1) is left        open, designating this particular LED module as the initiating        LED module for dynamic addressing when the LED light wire is        powered up. In the illustrated embodiment, the last LED module        is assigned position No. 0.

That is, the microcontroller of the LED module checks the status of itsinput port, and if that port is in an unconnected state, recognizes thatthe pixel to which it belongs should be assigned position 0. Themicrocontroller of LED module assigned position No. 0 then startsdynamically addressing by communicating its position to its neighboringLED module as No. 0 pixel and assigning thereby its neighbor's addressas No. 1. The pixel with an address so assigned then communicates withits succeeding neighboring LED module, in a daisy chain recursion,assigning addresses as shown in FIG. 27. In this manner, the individualpixels, each controlled by a microcontroller, assign their own addresseswhen powered up and can re-assign the own addresses should the one pixelfail or the LED light wire is cut. It should be noted that the status ofthe ports recognized by the microcontroller is not limited to being anopen state, but may be any predetermined state that could be recognizedby the microcontroller as being indicative of no connection.

In a preferred embodiment, all of the LED modules 2000 share a singledata line and each LED module sends to the remote display memory 2006requests for data (e.g., display data (e.g., current displayinformation)), which data is changed and refreshed by the displaycontroller 2008. The display controller 2008 would typically beprogrammed to update the display data in the display memory 2006, andeach pixel (LED module) picks up its respective data from the displaymemory 2006. A function of the display controller 2008 is to change andrefresh the display memory. The display memory 2006 and displaycontroller 2008 would preferably communicate with one another by the useof address bus 2010 and data bus 2012, as is known to those skilled inthe art.

The integrally formed LED light wires containing LED modules can be cutto any desired length, even when powered on and functioning. If theintegrally formed LED light wire is either cut while powered on, or cutwhile powered off and afterwards powered on, the cut creates an opencircuit and the S1 port of the LED module preceding the cut becomesdisconnected. Because the microcontroller of the LED module precedingthe cut would now recognize that its S1 port is open, it would thenassign itself position No. 0, and by the process described above becomethe new initiating LED module for dynamic addressing. All preceding LEDmodules acquire new addresses corresponding to the new initiating LEDmodule.

FIGS. 17A-17C depict an embodiment of the LED light wire using a seriesand parallel connection. This embodiment allows the LEDs to be turnedthrough 90° (positioned transversely instead of longitudinally) andmounted at a much closer pitch.

As shown in FIGS. 18 thru 19B and 24, the integrally formed LED lightwire may have a plurality of conductors (e.g., conductive bus elementsand conductive segments) which are coupled by zero ohm jumpers orresistors, LEDs, sensors, detectors and/or microprocessors, and aremounted on a support substrate. The functionality of the LED light wireincreases with each additional conductor. For example, a sensor ordetector which monitors environment conditions (such as humidity,temperature, and brightness) may be integrated in the LED light wire,and connected in such a manner that it may influence the lightingcharacteristics of the LED light wire. FIG. 18 shows an embodiment ofthe integrally formed LED light wire with sensors or detectors. Asshown, there are four continuous conductors corresponding to conductivebus elements 30, 32, 33 and 34. Zero ohm jumpers or resistors 10 coupleconductive segments 31 to conductive bus elements 30 and 32. Conductorbus element 32 acts as a common ground. Conductive bus element 30provides power to the LEDs 202, while conductive bus element 34 providespower to the sensor/detector 100. Conductive bus element 33 may directthe signal from the sensor/detector 100 to a power source which suppliespower to the LEDs 202; thereby, allowing the sensor/detector 100 toinfluence the lighting characteristics (e.g., intensity, color, pattern,on/off) of the LEDs 202.

FIGS. 19A and 19B show a full color integrally formed LED light wirehaving three continuous conductors corresponding to conductive buselements L1, L2 and L3 which supply power to the LEDs 202, and conductorsegments S1 and S2 connecting the LEDs 202 to conductive bus elementsL1, L2 and/or L3. In FIG. 19B, the LEDs 202 are SMD-On-Board LEDs.

In another embodiment, each pixel (LED module) may be controlledindependently. FIG. 24 shows the configuration of an individuallycontrollable LED light wire using seven conductors and LED modules 2120.Here, conductive bus element 80 acts as a power ground, while conductivebus element 81 acts as a voltage in. Each LED module 2120 includes amicroprocessor, at least one LED, power input and output connections,control signal input and output connections, and data input and outputconnections. In FIG. 24, the LED modules 2120 include VCC pins, VDDpins, enable pins, clock pins and data pins. The control signal and datainput connections of each LED module are coupled to the control signaland data input connections of an adjacent LED module. An optocoupler maybe used to insulate the control signal line between each LED module. TheLED modules 2120 may be connected in series (for example, as shown inFIG. 24) or in parallel (for example, the power input connections ofeach LED module 2120 is coupled to the first conductive bus element 81and the power output connection of each LED module 2120 is coupled tothe second conductive bus element 80).

A plurality of integrally formed LED light wires (such as LED light wire12, 13, 14) may be aligned side-by-side to form a lighting panel 3000 asshown in FIGS. 25A-25C. Each LED light wire may contain an interlockingalignment system comprising an alignment key 60, 62 and an alignmentkeyhole 61, both of which are pre-formed in the encapsulant of the LEDlight wire, wherein the alignment key 60, 62 and the alignment keyhole61 are located at opposite sides of the LED light wire. The alignmentkey 60, 62 and the alignment keyhole 61, 63 may continuously extend orintermittently extend longitudinally along the length of the LED lightwire. The alignment keyhole 61, 63 may be in the form of a notch, agroove, a recess, a slot, or an aperture, and the alignment key 60, 62may be in a form (including, but without limitation, a rail or a peg)which permits a friction fit (preferably, a snug fit) to the alignmentkeyhole 61, 63. The alignment key 60, 62 may have a width approximatelyequal to or slightly larger than the width of the alignment keyhole 61,63, such that the alignment key 60, 62 may fit therein in a frictionfit, as shown in FIGS. 25B and 25C. As an example, the alignment keyhole61, 63 may be a groove being adapted to friction fit with a rail-shapedalignment key 60, 62, both groove-shaped alignment keyhole 61, 63 andrail-shaped alignment 60 continuously extending longitudinally along thelength of the LED light wire.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

1. An integrally formed LED light wire, comprising (a) a conductive basecomprising a support substrate, wherein the support substrate comprisesa first plurality of wires, threads, or a combination thereof, whereinthe plurality of wires, threads, or a combination thereof comprises atleast one weft element arranged in a first direction and at least twowarp elements, each arranged in a second direction such that the atleast one weft element and each of the at least two warp elements formplural intersections therebetween, a first bus element formed from asecond plurality of wires, threads, or a combination thereof adapted todistribute power from a power source, a second bus element formed from athird plurality of wires, threads, or a combination thereof adapted todistribute power from the power source, a third bus element formed froma fourth plurality of wires, threads, or a combination thereof adaptedto distribute a control signal, wherein the first, second, and third buselements are woven, stitched, or knitted into the support substrate; and(b) a plurality of light emitting diode (LED) modules, each of saidplurality of LED modules comprising a microcontroller and at least oneLED, each LED module having first, second, and third electrical contactselectrically coupled to the first, second, and third bus elements,respectively, to draw power from the first and second bus elements andto receive a control signal from the third bus elements.
 2. Theintegrally formed LED light wire of claim 1, further comprising anencapsulant completely encapsulating the conductive base and theplurality of LED modules, including the respective microcontrollers. 3.The integrally formed LED light wire of claim 2, the encapsulant furthercomprises light scattering particles.
 4. The integrally formed LED lightwire of claim 1, further comprising at least one support warp whichcomprises a fifth plurality of wires, threads, or a combination thereofarranged in the second direction.
 5. The integrally formed LED lightwire of claim 1, wherein a connection between each of the plurality ofLED modules and at least one of the bus elements is selected from thegroup consisting of stitching, weaving, knitting, crimping, soldering,welding, or a combination thereof.
 6. The integrally formed LED lightwire of claim 1, wherein the second, third and fourth plurality ofwires, threads, or a combination thereof are each made of a plurality ofconductive wires and/or threads.
 7. The integrally formed LED light wireof claim 4, wherein the fifth plurality of wires, threads, or acombination thereof is made of a plurality of non-conductive wiresand/or threads.
 8. The integrally formed LED light wire of claim 6,wherein the conductive wires and/or threads is selected from the groupconsisting of nickel wire, steel wire, iron wire, titanium wire, copperwire, brass wire, aluminum wire, tin wire, sliver wire, nickel thread,steel thread, iron thread, titanium thread, copper thread, brass thread,aluminum thread, tin thread, sliver thread, or the like, or acombination thereof.
 9. The integrally formed LED light wire of claim 7,wherein the non-conductive wires and/or threads is selected from thegroup consisting of kevlar wire, nylon wire, cotton wire, rayon wire,polyester wire, laminate thread, flat thread, silk thread, glass fiber,polytetrafluoroethylene (“PTFE”), kevlar thread, nylon thread, cottonthread, rayon thread, polyester thread, a solid polymeric material, orthe like, or a combination thereof.
 10. The integrally formed LED lightwire of claim 1, wherein each of the plurality of LED modules furthercomprises a plurality of LEDs, wherein the plurality of LEDs areselected from the group consisting of red, blue, green, and white LEDs.11. The integrally formed LED light wire of claim 1, wherein each of theplurality of LED modules further comprises a fourth contact foroutputting the received control signal.
 12. The integrally formed LEDlight wire of claim 1, wherein each LED module has a unique address usedto control the LED module.
 13. The integrally formed LED light wire ofclaim 12, wherein the unique address is static.
 14. The integrallyformed LED light wire of claim 12, wherein the unique address isdynamic.
 15. An integrally formed LED light wire, comprising: (a) aconductive base comprising a support substrate, wherein the supportsubstrate comprises a first plurality of wires, threads, or acombination thereof, wherein the plurality of wires, threads, or acombination thereof comprises at least one weft element arranged in afirst direction and at least two warp elements, each arranged in asecond direction such that the at least one weft element and each of theat least two warp elements form plural intersections therebetween, afirst, second, third, and fourth conductive bus elements, each formedfrom a second, third, fourth, and fifth plurality of wires, threads, ora combination thereof, respectively, wherein the first, second, third,and fourth conductive bus elements are woven, stitched, or knitted intothe support substrate; and at least one conductor segment arrangedbetween the first and second conductive bus elements, the at least oneconductor segment comprising at least one LED and a sixth plurality ofwires, threads, or a combination thereof, wherein the at least oneconductor segment is woven, stitched, or knitted into the supportsubstrate; and (b) at least one sensor electrically coupled to the thirdand fourth conductive bus elements, the third conductive bus element isadapted to transmit signals from the at least one sensor, and the fourthconductive bus is adapted to provide power to the at least one sensor.16. The integrally formed LED light wire of claim 15, wherein the secondconductive bus element is a ground and the at least one sensor isadditionally electrically coupled to the second conductive bus element.17. The integrally formed LED light wire of claim 15, further comprisingan encapsulant completely encapsulating the conductive base, and the atleast one sensor electrically coupled to the third and fourth conductivebus elements.
 18. The integrally formed LED light wire of claim 17,wherein the encapsulant further comprises light scattering particles.19. The integrally formed LED light wire of claim 11, wherein aconnection between the at least one LED and the sixth plurality of wiresis selected from the group consisting of stitching, weaving, knitting,crimping, soldering, welding, or a combination thereof.
 20. Theintegrally formed LED light wire of claim 2 or 17, wherein the outerprofile of the encapsulant comprising an alignment key and an alignmentkeyhole located at opposite sides of the integrally formed LED lightwire.
 21. A lighting panel comprising a plurality of the integrallyformed LED light wires of claim 20.